Solid-state high power device and method

ABSTRACT

A high-power solid-state transistor structure comprised of a plurality of emitter or gate fingers arranged in a uniform or non-uniform manner to provide improved high power performance is disclosed. Each of the fingers is associated with a corresponding one of a plurality of sub-cells. In an exemplary embodiment, the fingers may be arranged in a 1-D or 2-D form having a “hollow-center” layout where one or more elongated emitter fingers or subcells are left out during design or disconnected during manufacture. In another exemplary embodiment, the fingers may be arranged in a 1-D or 2-D form having one or more “arc-shaped” rows that includes one or more elongated emitter fingers or subcells. The structure can be practically implemented and the absolute thermal stability can be maintained for very high power transistors with reduced adverse effects due to random variation in the manufacturing and design process.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.10/993,224 that was filed Nov. 19, 2004, the disclosure of which isincorporated by reference; which is a continuation-in-part of U.S.patent application Ser. No. 10/718,757 that was filed Nov. 21, 2003, thedisclosure of which is incorporated by reference. U.S. patentapplication Ser. No. 10/993,224 claims the benefit of provisionalapplication No. 60/607,767 that was filed Sep. 7, 2004, the disclosureof which is incorporated by reference and of provisional application No.60/607,762 that was filed Sep. 7, 2004, the disclosure of which isincorporated by reference.

REFERENCE TO GOVERNMENT RIGHTS

This invention was made with United States government support awarded bythe following agencies: National Science Foundation, Electrical &Communications System Div., Award No. 0323717. The United Statesgovernment has certain rights in this invention.

FIELD OF THE INVENTION

The present disclosure relates generally to high power solid-statedevices, and more particularly to high power solid-state devicestructures that are capable of providing high power performance and acorresponding method of design of such structures.

BACKGROUND OF THE INVENTION

High power solid-state devices able to amplify radio frequency (“RF”)and microwave signals are used today in a variety of applications, forexample in cell phones and other wireless communication systems. Bipolarjunction transistors, including heterojunction bipolar transistors(HBTs), are commonly used in such systems for amplifying small-amplitudesignals and delivering amplified RF power to an antenna. Althoughbipolar junction transistors (BJTs) are used herein to describe thebackground of this invention, this is by way of example and does notlimit the scope of the invention disclosed herein.

High power solid-state devices for amplifying RF and microwave signalscan be fabricated using a variety of materials, but silicon germanium(“SiGe”) and gallium arsenide (“GaAs”) are the most widely usedmaterials for commercial applications at the present time. Most poweramplifiers for cell phones are made using GaAs, because currentfabrication technologies using that material can deliver devices withrelatively high power output (1-4 W) at the relatively low frequencies(800 Mhz-1.9 Ghz) used by most cell phones. Most power amplifiers forwireless networking products use SiGe, because current fabricationtechnologies using that material can allow high level integration toreduce cost deliver devices that can operate at somewhat higherfrequencies (2.4 Ghz-60 Ghz) but at the reduced power (10-200 mWtypical) used by wireless networking products such as 802.11b (“WiFi”).Besides the electronic properties which differ between GaAs and SiGedevices, the two different materials also have different thermalconductivities which require somewhat different techniques for heatmanagement.

The effective range of a wireless communication system depends on themaximum RF power that can be produced by that wireless communicationsystem. The maximum RF power that can be produced by a device depends onthe active device area, with the power capacity increasing as the activedevice area increases.

The bandwidth, or information transmission capacity, of a wirelesscommunication system depends on the maximum frequency range that can beamplified effectively by that wireless communication system. As thepower capacity and associated active device area of a device increases,the adverse effects of heat and increased parasitics also increase, soin practice it is generally the case that increasing the power capacityof a given device will decrease the maximum frequency range that can beamplified effectively by that device.

Especially for wireless communication systems, such as cell phones, thatuse batteries for electrical power, the so called power added efficiency(“PAE”) at which input battery power is converted to usable RF power(instead of being wasted, for example, as heat) determines how long sucha device can be used before it must be recharged. For the reasonsdiscussed above, device designs that maximize power added efficiency andRF power output while maintaining adequate high frequency performanceare needed.

As discussed above, the power capacity of an active device increases asthe active device area increases. For example, the maximum RF powerlevel that can be produced by a BJT depends on the emitter area of theBJT, with the maximum RF power level increasing as the emitter areaincreases. Because of problems such as the emitter current crowdingeffect, it is known to divide the total emitter area of a BJT intomultiple emitter “fingers” separated from one another. It is also knownthat the specific arrangement of these multiple emitter fingers canaffect many aspects of the performance of such a device.

FIG. 1 shows an exemplary prior art BJT 20 having a base 22, emitter 24,collector 25, and multiple emitter fingers 26 separated by a uniformdistance X 28. Although FIG. 1 is a compact layout that saves chip area,this type of layout is known to have poor thermal stability andperformance due to severe thermal coupling between emitter fingers (theyare too close) and excessive parasitic collector resistance.

FIG. 2 shows another exemplary prior art BJT 30 also having multipleemitter fingers 26. Unlike the device of FIG. 1, the multiple emitterfingers of the device of FIG. 2 are grouped into four subcells 32, witheach of the four subcells 32 having two emitter fingers 26. In thedevice of FIG. 2, the subcells 32 are separated from one another bycollector regions, with a uniform distance Y 34 between the centers ofadjacent subcells 32. The device 30 of FIG. 2, although somewhat lesscompact than the device 20 of FIG. 1, is known to provide reducedcollector resistance and thermal effects in exchange for the increaseddevice area.

Although the device 20 of FIG. 1 and the device 30 of FIG. 2 havesomewhat different performance characteristics, both devices haveuniform spacing between the multiple emitter fingers 26 (in the deviceof FIG. 1) and between the multiple subcells 32 (in the device of FIG.2). It is known that devices having uniformly spaced emitter fingers 26,or uniformly spaced emitter finger subcells 32, are typically subject toadverse thermal effects caused by a higher and localized devicetemperature rise in the center of these types of devices duringoperation, as further explained below.

When the transistors in the devices of FIGS. 1 and 2 are initiallybiased, equal current passes through each emitter finger 26, and thisequal current produces an equal amount of heat in each finger. Overtime, heat dissipates more slowly from the center fingers compared tothe fingers on the periphery of the device. This is because the centerfingers are surrounded by other emitter fingers that are also producingheat, unlike the peripheral fingers which are adjacent to coolerinactive regions where there are no emitter fingers producing heat. Forthis reason, devices like those of FIGS. 1 and 2 tend to operate with anon-uniform temperature distribution wherein the center fingers arehotter than the edge fingers.

It is also known that the non-uniform temperature distribution common tothese types of devices can make them unstable at high output levels. Thehigher temperature of the center fingers can cause the so-called“current hogging” effect, wherein the higher temperature center fingersdraw more current than the peripheral fingers subject to the same biasvoltage. Current hogging occurs when the increased temperature of thecenter fingers causes an increase in current through those centerfingers. The increased current through the center figures increases theheat produced in those center fingers, which in turn exacerbates thetemperature difference between the hotter center fingers and the coolerperipheral fingers. Even if this effect does not cause the device to gocompletely unstable, it can nonetheless severely degrade deviceperformance, for example by decreasing high frequency gain. In the worstcase, thermal runaway and catastrophic failure occurs.

One prior art approach to improve the thermal stability and maintain auniform junction temperature across the multiple emitter fingers 26, ormultiple subcells 32, of a power transistor, is to connect equally- orunequally-valued ballast resistors 38 in series with each emitter finger26 as shown in the device 36 of FIG. 3 and the device 40 of FIG. 4.These ballast resistors 38 typically have values in the range of 20-100ohms, and provide a negative feedback mechanism between temperature andcurrent of the emitter fingers or subcells. When more current is drawnby the center emitter finger 26 or subcell 32 due to the rising oftemperature, the voltage drop across the ballast resistors 38 increases.Hence, the voltage available to the emitter fingers 26 is reduced andless heat is thus generated by these fingers.

Although ballast resistors 38 can provide thermal stability and improvetemperature uniformity across the multiple emitter fingers 26, oremitter finger subcells 32, the use of ballast resistors 38 canadversely affect important measures of device performance. First, usingballast resistors will tend to reduce the maximum RF power output fromthe device. This is because the emitter fingers and subcells in serieswith the ballast resistors will be underbiased compared to a devicewithout ballast resistors, since the available bias voltage must beshared between the ballast resistors and the remainder of the device. Inaddition, the ballasting resistors increase the RC delay and therebyadversely affect the high frequency performance of the device. Finally,the voltage drop across the ballast resistors ends up as heat instead ofas RF output power, thereby wasting power and reducing the efficiency(“PAE”) of converting DC supply power into RF signal power for the powertransistors.

Another prior art approach to improve the thermal stability and maintaina uniform junction across the multiple emitter fingers of a powertransistor is to make the spacing between the emitter fingersnon-uniform. This approach is discussed, for example, in U.S. Pat. No.6,534,857. In this type of layout, the emitter finger spacing isnon-uniform, with more spacing between the emitter fingers in the centerregion and less spacing between the edge fingers. The spacing isarranged with the goal of providing a uniform junction temperatureacross the emitter fingers. Similar benefits can be obtained by usingprogressively narrower widths of emitter fingers from the peripherytoward the center region of the power transistor, or by usingprogressively shorter emitter finger lengths from the periphery towardthe center region of the power transistor, for example as shown in U.S.Pat Nos. 5,616,950 and 5,850,099.

The aforementioned techniques involving non-uniform dimensioning andplacement of the emitter fingers theoretically might produce thermalstability and uniform junction temperature regardless of the totalnumber of emitter fingers in such a device. However, there are importantpractical limitations to this technique, especially for very large powertransistors.

First, although it may be possible to calculate to a high degree ofprecision the dimensions and positions for emitter fingers that willoptimize thermal stability and uniformity, it is much more difficult toactually manufacture emitter fingers in accordance with those calculatedoptimal dimensions and locations. The lithographic processes used tomanufacture the emitter fingers always have statistical variations thatcause the widths and locations of the emitter fingers to vary. Thisvariation can be caused, for example, by variations in the opticalcolumn or mask used to print the emitter fingers, by variations in thephotoresist or developer used to image the emitter fingers, or byvariations in the etch or deposition processes used to prepare theemitter fingers. This variation can manifest itself, for example, infinger-to-finger variation within a transistor, intransistor-to-transistor variation within a batch, or in day-to-dayvariation between batches.

Second, although it may be possible to calculate to a high degree ofprecision the dimensions and positions for emitter fingers that willoptimize thermal stability and uniformity, practical chip layout toolsdo not provide for arbitrarily small increments of dimensions andpositions in design rules. Thus, especially when the dimensions andspacings of the emitter fingers are of the same order of magnitude asthe minimum feature size available in the process being used tomanufacture the transistors and/or the minimum dimension and locationincrements of the design rules of the software used to layout thetransistor, there are important practical limits to realizing absoluteuniformity of temperature and temperature stability using the prior arttechniques involving non-uniform dimensioning and spacing of the emitterfingers.

Moreover, when the number of emitter fingers arranged in a single rowbecomes very large, the spacing non-uniformity of the emitter fingersresiding in the center region of a power transistor becomes verygradual. As shown in FIG. 5, while emitter fingers 1 and 10 of a10-finger power transistor fall on the outside edges of that 10-fingertransistor, emitter fingers 1 and 10 of a 20-finger power transistorfall within the central area of that 20-finger transistor. Hence, morespacing will be required around emitter fingers 1 and 10 in the20-finger transistor compared to the 10-finger transistor.

In comparison to the 10-finger power transistor where emitter fingersNo. 4-7 are the center fingers, emitter fingers (No. 4-No. 16) in the20-finger power transistor are all center fingers. The available spacein the center area must be shared among all the center fingers, thus thecentral area of a 20 finger device becomes crowded because the edge areain a 20-finger device remains the same as in the 10-finger device. Thedifference in the theoretically optimum spacing between, for example,emitter fingers 4 and 5 and the spacing between emitter fingers 5 and 6in a 20-finger device can be very small. The above-described practicallimitations in manufacturing and design introduce variation in thedimensions and locations of emitter fingers that can result insignificant temperature non-uniformity once the device's operationreaches its steady state.

Exacerbating the problem is the fact that the larger is the total numberof emitter fingers in a power transistor, the higher is the junctiontemperature (FIG. 6). That is, without any statistical variations inemitter finger locations and dimensions, devices with a large number ofemitter fingers run hotter than similarly constructed devices with feweremitter fingers. Because devices with large numbers of emitter fingersrun hotter, statistical variations in emitter fingers and locations canrender these devices especially susceptible to current “hogging” due tothe formation of local hot spots, or thermal runaway trigged by localnon-uniformity of emitter finger width, e.g., statistical variation ofthe lithography feature size.

As a result, the dimensions and locations of the emitter fingers can bequite critical, and even small variations in dimensions can create largevariations in temperature uniformity. FIG. 7(a) shows an exemplary priorart 23-emitter finger GaAs HBT, with nominal 2 μm finger width andnominal 20 μm finger length. The emitter fingers of the device of FIG.7(a) are arranged in a non-uniform fashion to produce theoreticallyuniform junction temperatures, assuming that-the emitter fingers aremanufactured to have perfect locations and dimensions.

FIGS. 7(b) and 7(c) present calculated steady-state temperature andcurrent distributions of the device of FIG. 7(a) under the assumptionthat process variation has increased the width of the No. 12 emitterfinger 42 to 2.02 μm. That is, the No. 12 emitter finger 42 is assumedto be 1% wider than the nominal 2μ width of the other emitter fingers inthe device of FIG. 7(a). FIG. 7(b) shows the calculated temperatureprofile across the emitter fingers resulting from this 1% variation inwidth of the no. 12 emitter finger 42. FIG. 7(c) shows the calculatedcurrent profile across the emitter fingers resulting from this 1%variation in width of the no. 12 emitter finger 42 during steady-statehigh power operation. These results show that even slight variations infinger dimensions can substantially degrade temperature uniformity andcause current hogging.

Generally, as the number of emitter fingers increases, smaller fingerwidth variations will produce current hogging and temperaturenon-uniformity. Similarly, higher operating temperatures and higheroutput power tend to increase these adverse effects on temperatureuniformity caused by process variation.

In summary, practical limitations in the manufacturing and design ofpower transistors having a very large number of emitter fingers limitthe utility of non-uniform dimensioning and location of emitter fingersin achieving temperature uniformity and thermal stability in suchdevices. As a result, these prior art techniques are mainly useful forlow and medium power transistors where not many emitter fingers arerequired. What is needed is a power transistor structure suitable forhigh power transistors using large numbers of emitter fingers and havingbetter power performance, improved manufacturability, and more reliablethermal stability compared to prior-art power transistor structures.What is further needed are structures and dimensions which areparticularly suited for SiGe applications, and other structures anddimensions which are particularly suited for GaAs applications.

SUMMARY OF THE INVENTION

An exemplary high power transistor includes a plurality of emitterfingers fabricated on a common semiconductor chip. The emitterelectrodes may be bipolar junction transistors or heterojunction bipolartransistors in the form of parallel elongated finger elements having auniform or non-uniform spacing. The fingers may be arranged in a1-dimensional (1-D) or 2-dimensional (2-D) form such that the potentialthermal instability at high power operation is reduced or eliminated. Inan exemplary embodiment, the fingers may be arranged in a 1-D or, 2-Dform having a “hollow-center” layout where one or more elongated emitterfingers or subcells are left out during design or disconnected duringmanufacture. In another exemplary embodiment, the fingers may bearranged in a 1-D or 2-D form having one or more “arc-shaped” rows thatincludes one or more elongated emitter fingers or subcells.

Other principal features and advantages of the invention will becomeapparent to those skilled in the art upon review of the followingdrawings, the detailed description, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the invention will hereafter be described withreference to the accompanying drawings, wherein like numerals willdenote like elements.

FIG. 1 is a top planar view of the layout of a prior-art power bipolarjunction transistor having a plurality of uniformly-spaced emitterfingers;

FIG. 2 is a top planar view of the layout of a prior-art power bipolarjunction transistor having a plurality of emitter fingers arranged inuniformly spaced subcells each having 2 emitter fingers;

FIG. 3 is a top planar view of the layout of a prior-art power bipolarjunction transistor having a plurality of uniformly-spaced emitterfingers each with a ballast resistor;

FIG. 4 is a top planar view of the layout of a prior-art power bipolarjunction transistor having a plurality of emitter fingers arranged inuniformly-spaced subcells each having 2 emitter fingers each with aballast resistor;

FIG. 5 is a top planar view of the layouts of four exemplary prior-artpower bipolar junction transistors having 5, 10, 20, and 30 emitterfingers arranged non-uniformly;

FIG. 6 presents calculated temperature profiles for the four exemplarypower bipolar junction transistor layouts of FIG. 5;

FIG. 7(a) is a top planar view of the layout of a prior-art powerbipolar junction transistor having 23 emitter fingers arrangednon-uniformly;

FIG. 7(b) shows the calculated temperature profile during steady-statehigh power operation of the device of FIG. 7(a) assuming that emitterfinger number 12 is 1% wider than intended;

FIG. 7(c) shows the calculated current profile during steady-state highpower operation of the device of FIG. 7(a) assuming that emitter fingernumber 12 is 1% wider than intended;

FIGS. 8(a)-8(f) show an exemplary fabrication process for fabricating aSiGe (a similar process can be used for GaAs) bipolar junction powertransistor having two emitter fingers;

FIG. 9 is a top planar view of a power bipolar junction transistoraccording to an exemplary embodiment having non-uniformly spaced emitterfingers;

FIG. 10 is a top planar view of another power bipolar junctiontransistor according to an exemplary embodiment having emitter fingersarranged in non-uniformly spaced subcells each having 2 emitter fingers;

FIG. 11(a) is a top planar view of another power bipolar junctiontransistor according to an exemplary embodiment having non-uniformlyspaced emitter fingers arranged in two arc-shaped rows;

FIG. 11(b) shows the calculated temperature profile along one row ofemitter fingers in the device of FIG. 11 (a);

FIG. 12(a) is a top planar view of another power bipolar junctiontransistor according to an exemplary embodiment having non-uniformlyspaced emitter fingers arranged in two arc-shaped rows surrounding athird straight center row of fingers;

FIG. 12(b) is the calculated temperature profile along the center row ofemitter fingers in the device of FIG. 12(a);

FIG. 13 is a top planar view of another power transistor structureaccording to an exemplary embodiment with emitter fingers surrounding a“hollow center” central gap where an emitter finger is missing;

FIG. 14 is a top planar view of another power transistor structureaccording to an exemplary embodiment with subcells each having twoemitter fingers and surrounding a “hollow center” central gap where asubcell is missing;

FIG. 15 is a top planar view of another power transistor structureaccording to an exemplary embodiment with non-uniformly spaced subcells,each with two emitter fingers, surrounding a central subcell having asingle emitter finger;

FIG. 16(a) is a top planar view of an exemplary prior-art bipolar powertransistor layout;

FIG. 16(b) is a top planar view of a power transistor in accordance withan exemplary embodiment having the same number of emitter fingers andsubcells, and the same chip area, as the device of FIG. 16(a); and

FIG. 16(c) shows the measured power performance data of the device ofFIG. 16(b) compared to the prior art device of FIG. 16(a).

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

As previously discussed, high power transistors commonly employ multiplefinger structures to increase the total power output. For bipolarjunction transistors and heterojunction bipolar transistors, thesemultiple fingers are emitter fingers. Although the following embodimentsof this invention are described using bipolar junction transistors asexamples, the bipolar junction transistors are used by way of example,and not as a limitation on the scope of the invention.

By way of example, and not as a limitation, FIGS. 8(a)-8(f) show anexemplary prior art fabrication process for fabricating a SiGe bipolarjunction power transistor having two emitter fingers. The prior artprocess of FIGS. 8(a)-8(f), sometimes called the double-mesa process,can be used for fabricating X-band SiGe HBT devices. This prior artprocess is highly repeatable and reliable, and typically employs 7 masklevels and 20 steps. This prior art process is used herein as an exampleof a process for implementing SiGe or GaAs power transistors using thespecific dimensions and device layouts of the present invention, but itis by no means the only such process that could be used.

The exemplary process of FIGS. 8(a)-8(f) begins with a material stackformed on an Si substrate 62, followed by a heavily N-type doped Sisubcollector layer 60, a lightly n-type doped Si collector layer 58, ap-type doped SiGe base layer 56, and an n-type doped Si emitter layer53. Emitter metal contacts 52 are formed using standard photolithographyand liftoff techniques. The emitter metal 52, for example Cr or Au, isfirst evaporated on top of the highly doped emitter cap layer 53 of theSi/SiGe/Si heterostructure. The multi-emitter metal fingers 52,typically 2 microns wide, are formed with the first-level mask, leavingthe structure shown in FIG. 8(a). The width of the emitter fingers maybe subject to statistical variations as discussed above.

The patterned emitter metal fingers 52 then serve as self-aligned maskfor subsequent dry/wet etching of the Si emitter layer 53 to expose theboron-doped SiGe base layer 56, leaving the structure shown in FIG.8(b). Another photolithography step is used to form self-aligned basemetal 55 on top of the exposed SiGe base layer 56, leaving the structureshown in FIG. 8(c).

The third mask is used to form the base mesa by RIE and to expose thehighly doped subcollector layer 60 for collector contact formation,leaving the structure shown in FIG. 8(d). Next, collector metal 64 isdeposited and formed in another lithography step (4th mask). The activedevices are isolated by removing the subcollector material 60 around thedevices and exposing the high-resistivity Si substrate 62 (5th mask),leaving the structure shown in FIG. 8(e).

A conformal PECVD SiO2 deposition is used to form a passivation layer 66over the active device 50 and the exposed substrate 62. Contact viaholes 68 are opened in the passivation layer 66 by RIE (6th mask) andinterconnect pad metal 67 is deposited and then patterned withphotolithography (7th mask) to finish the fabrication process and formthe completed device 50 shown in FIG. 8(f).

Referring to the drawings, FIG. 9 is a top planar view of a powerbipolar junction transistor 70 according to an exemplary embodimenthaving non-uniformly spaced emitter fingers 26 with small ballastresistors 71. In the device 70 of FIG. 9, a non-uniform spacing ofemitter fingers 26 is arranged using the finite element analysissoftware, based on the known heating power density. The side-to-side orlateral distance between adjacent emitter fingers 26 increases from thecenter of the device 70 to the periphery, so that distance X1>X2>X3.

The arrangement of the multiple emitter fingers 26 must adhere to theapplicable design rules of the technology used to build the device.Since any design rule will have some minimum allowable increment ofdistance, even if the perfect placement and spacing of the multipleemitter fingers can be calculated, this perfect placement and spacingcannot be implemented in practice, so at least some non-uniformity ofjunction temperature should be expected.

In the device 70 of FIG. 9, the emitter fingers 26 of this powertransistor are each connected in series with a small ballast resistor71, although this is not required and less than all of the emitterfingers may include the small ballast resistor 71. For example, in anappropriate application small ballast resistors 71 can be omitted fromthe emitter fingers 26 on the periphery while maintaining small ballastresistors 71 on at least some of the central emitter fingers 26 tomaintain temperature stability. The small ballast resistor is preferablyin the range 1-10 ohms.

In an appropriate fabrication process, such a small valued ballastresistor can be formed simply by shrinking the size of a contact hole 68to the emitter 24, for example to the emitter metal 52, to create thedesired resistance in series with the emitter finger 26, with noadditional structure or processing step required. The values of theresistors in accordance to the preferred embodiment are calculated basedon the known maximum statistical variation of the finger width with thegoal of a thermally stable operation condition. The calculation mayinvolve iterations using measured or calculated thermal-electriccoefficients and heating power density.

Although the small ballast resistors 71 are connected to emitter fingersin the device 70 of FIG. 9, similar layouts with small ballast resistors71 connected in series with the base 22 can also be used, instead of orin addition to small ballast resistors 71 in series with the emitter 24.In an appropriate fabrication process, such a small valued ballastresistor can be formed simply by shrinking the size of a contact hole tothe base 22, for example to the base metal 55, to create the desiredresistance in series with the base 22, with no additional structure orprocessing step required.

In comparison to the prior-art approach which uses ballast resistors 38having values in the range of 100 ohms, the small ballast resistors 71in the device 70 of FIG. 9 have values in the range 1-10 ohms,preferably around 1-3 ohms, and these small ballast resistors 71 areused to prevent thermal instability caused by small variations of fingerspacing and finger width. As a result, only a very small fraction ofballast resistor values of the prior-art ballast resistor values isneeded in this invention. Hence, the small ballast resistors 71 of thisapproach can have significantly improved power, efficiency, and highfrequency performance compared to prior approaches that use largerballast resistors 38.

FIG. 10 is a top planar view of another power bipolar junctiontransistor 74 according to the invention having emitter fingers 26arranged in non-uniformly spaced subcells each having 2 emitter fingerswith small ballast resistors. Although two fingers are grouped in asubcell in this example, more fingers can be grouped together if thefinger width is small. The non-uniform layout is arranged by adhering tothe design rule. The side-to-side or lateral distance between adjacentsubcells 32 increases from the center of the device 74 to the periphery,so that distance Y1>Y2. To ensure worst-case thermal stability, thevalues of the small ballast resistors can be determined by assuming thewidth of all the emitter fingers in the center subcell or subcells havethe maximum possible finger width and assuming the distance between thecentral adjacent subcells is the minimum, given the expected variationin finger width and subcell spacing in the manufacturing process used.The advantages of this small ballast resistor approach are reducedbase-collector junction capacitance and parasitic collector resistancein comparison to the prior art which uses relatively large ballastresistors.

FIG. 11(a) is a top planar view of another power bipolar junctiontransistor 78 according to an exemplary embodiment having non-uniformlyspaced emitter fingers 26 each with a small ballast resistor 71 andarranged in two arc-shaped rows. The dimensions and arrangement of the2-dimensional thermally balanced structure is designed to avoid the needfor larger valued ballast resistors 38 to ensure thermal stability ofthe device 78 arising from the statistical variation of finger width andallowable minimal increment of emitter finger spacing in the one-rownon-uniform layout. The side-to-side or lateral distance betweenadjacent emitter fingers 26 increases from the center of the device 78to the periphery, so that distance X1>X2>X3. The front to back distancebetween the rows of adjacent emitter fingers 26 also increases from thecenter of the device 78 to the periphery, so that distance Z1>Z2. Ofcourse, the arrangement of the two rows of emitter fingers 76 mustadhere to the design rules of the process used to manufacture the device78.

FIG. 11(b) shows the calculated temperature profile along one row ofemitter fingers of the device 78 of FIG. 11(a). The temperaturenon-uniformity shown in FIG. 11(b) due to the limitation of minimalincrement of finger spacing is expected. The values of small ballastresistors 71 can be selected in a similar fashion to the devices ofFIGS. 9 and 10, by assuming that the central emitter fingers 26 have themaximum finger width and minimum spacing expected in the manufacturingprocess used to fabricate the device 78, to ensure worst case thermalstability.

Although the device of FIG. 11(a) includes a single finger structure forillustration, subcell structures with two or more emitter fingersgrouped together can also be used. Again, small ballast resistors 71 canbe placed in series with the base 22, instead of or in addition to smallballast resistors 71 in series with the emitter 24.

In addition, although arc-shaped rows are used for the illustration ofthe 2-D thermal balance structure in the device of FIG. 11 (a), the tworows can be straightened up. In either case, the spacing between tworows affects the selection of ballast resistor values of the emitterfingers. Using small ballast resistors 71 having similar values to thesmall ballast resistors 71 used in the device 70 of FIG. 9, thethermally stable power output of a device similar to that of FIG. 11(a)but with two straightened up rows may be substantially greater than thedevice of FIG. 9 with similar device area.

FIG. 12(a) is a top planar view of another power bipolar junctiontransistor 80 according to an exemplary embodiment having non-uniformlyspaced emitter fingers 26 each having a small ballast resistor 71 andarranged in two arc-shaped rows surrounding a third straight center rowof fingers. The side-to-side or lateral distance between adjacentemitter fingers 26 increases from the center of the device 80 to theperiphery, so that distance X1>X2>X3. The front to back distance betweenthe rows of adjacent emitter fingers 26 also increases from the centerof the device 80 to the periphery, so that distance Z1>Z2. Although athree-row layout is shown in FIG. 12(a) as an example, layouts of morethan three rows can also be used. Although all the emitter fingers 26 indevice 80 include small ballast resistors 71, this is not necessary andin an appropriate case fewer than all the emitter fingers 26 may includea small ballast resistor 71, and the values of the small ballastresistors 71 need not all be the same.

FIG. 12(b) is the calculated temperature profile along the center row ofemitter fingers 26 in the device 80 of FIG. 12(a). Similar to the deviceof FIG. 11 (a), temperature nonuniformity is expected when a design ruleis adhered to, because of the imprecision in emitter finger placementresulting from the finite resolution of design rules. Subcell structures32 can replace the single emitter finger structures 26 and small ballastresistors 71 instead of or in addition to small emitter ballastresistors 71 can also be used in a device 80 according to an exemplaryembodiment similar to that of FIG. 12(a). In addition, all the multiplerows can be straightened up and the center row or rows can have smallernumber of emitter fingers or subcells than the outer rows. The values ofthe small ballast resistors 71 can be selected in a similar fashion tothe device of FIG. 9.

FIG. 13 is a top planar view of another power transistor structure 82according to an exemplary embodiment with non-uniformly spaced emitterfingers surrounding a central gap (“hollow center”) 84. Like the device70 of FIG. 9, the side-to-side or lateral distance between adjacentemitter fingers 26 increases from the center of the device to theperiphery, so that distance X1>X2>X3. However, in the device 82 of FIG.13, the side-to-side distance X1 is much greater than the side-to-sidedistance between other pairs of adjacent emitter fingers, whereby X1 ismore than twice as large as the distance between any other two pairs ofadjacent emitter fingers.

Using the “hollow center” 84 in the device 82 of FIG. 13, the multipleemitter fingers may be arranged either in a uniform or non-uniformfashion while adhering to the design rule, and still achieve thermallystable operation. Instead of seeking a nearly uniform temperaturedistribution, the hollow center 84 in the device of FIG. 13 can resultin a non-uniform temperature where the center is cooler than theperiphery, to overcompensate and make the device 82 even more thermallystable.

The potential thermal instability that may be triggered by the deviationfrom the required emitter finger spacing and/or by statistical variationof finger width is ameliorated using the hollow center 84. The hollowcenter 84 can be implemented by placing a gap at the center of thedevice 82 when designing the device, or the hollow center 84 can beimplemented by electrically disconnecting or removing one or more of thecenter emitter fingers 26 after the device 82 has been partiallyfabricated.

The “hollow center” 84 can be applied to layouts of multiple rows andcan also be applied to a single row at locations instead of or inaddition to center locations when the number of emitter fingers issufficiently large. Although a non-uniform arrangement of emitterfingers is preferred, it is not required for this embodiment, and the“hollow center” 84 can be used even when all the other emitter fingersare uniformly spaced. Accordingly, both uniform and non-uniformarrangements of emitter fingers using the “hollow center” 84 can be usedin a device according to an exemplary embodiment. The device 82 of FIG.13 may also include one or more small valued ballast resistors 71connected to one or more of the emitter fingers or the base, althoughthis is not required.

FIG. 14 is a top planar view of another power transistor structure 86according to an exemplary embodiment with non-uniformly spaced subcells32, each with two emitter fingers 26, surrounding a “hollow center” 88central gap. Although the device 86 of FIG. 14 has subcells 32containing two emitter fingers 26, this is not required and subcellscontaining a greater number of emitter fingers could be used.

Like the device 74 of FIG. 10, the side-to-side or lateral distancebetween adjacent subcells 32 increases from the center of the device tothe periphery, so that distance Y1>Y2. However, in the device 86 of FIG.14, the side-to-side distance Y1 is much greater than the side-to-sidedistance between other pairs of adjacent subcells, whereby Y1 is morethan twice as large as the distance between any other two pairs ofadjacent subcells.

The hollow center 88 can be formed by electrically disconnecting orremoving selected subcells during manufacture or the hollow center 88subcells can be simply left out during layout of the device. The device86 of FIG. 14 may include one or more small valued ballast resistors 71connected to one or more of the emitter fingers and/or the base,although this is not required.

FIG. 15 is a top planar view of another power transistor structure 90according to an exemplary embodiment with subcells 94, each with twoemitter fingers, surrounding a central subcell 92 having a singleemitter finger. Like the device 74 of FIG. 10 and the device 86 of FIG.14, the side-to-side or lateral distance between adjacent subcellsincreases from the center of the device to the periphery, so thatdistance Y1>Y2. However, in the device 90 of FIG. 15, the centralsubcell has a reduced number of emitter fingers compared to the othersubcells, instead of a “hollow center” subcell 88 used in the device 86of FIG. 14.

Although the device 90 of FIG. 15 includes one single-finger centralsubcell 92 surrounded by other subcells 94 each containing 2 emitterfingers, the surrounding subcells 94 could have a greater number ofemitter fingers. Similarly, if the surrounding subcells have a greaternumber of emitter fingers, the central subcell could also have a greaternumber of emitter fingers, as long as the number of emitter fingers inthe central subcell 92 is less than the number of emitter fingers in thesurrounding subcells 94. The device 90 of FIG. 15 may also include oneor more small ballast resistors 71 connected to one or more of theemitter fingers and/or the base.

FIG. 16(a) is a top planar view of an exemplary prior-art SiGe HBT powertransistor 96 with a uniform layout. The 16 emitter fingers 26 aregrouped in 8 subcells 32 and uniformly spaced along a single row. FIG.16(b) is a top planar view of a power transistor 98 in accordance withan exemplary embodiment having the same number of emitter fingers andsubcells, and the same chip area, as the device 96 of FIG. 16(a).

Unlike the uniformly-spaced single row of subcells used in the device 96of FIG. 16(a), the device 98 of FIG. 16(b) includes 8 subcells arrangednon-uniformly in a 2-dimensional form, in accordance with an exemplaryembodiment, while keeping the same chip area and the same subcellstructure as the device 96 of FIG. 16(a). The side-to-side or lateraldistance between adjacent subcells 32 increases from the center of thedevice 98 to the periphery, so that distance Y1>Y2. The front to backdistance between the rows of adjacent subcells 32 also increases fromthe center of the device 98 to the periphery, so that distance Z1>Z2.The device 98 of FIG. 16(b) may also include one or more small ballastresistors 71 connected to one or more of the emitter fingers and/or thebase.

FIG. 16(c) shows the measured power performance data of the device ofFIG. 16(b) compared to the prior art device of FIG. 16(a), when bothHBTs are fabricated on the same chip and operated at the same bias andinput signal levels. The results shown in FIG. 16(c) demonstrate thatoutput power, power gain and power added efficiency are simultaneouslyimproved using the 2-dimensional layout of the device 98 of FIG. 16(b)compared to the 1-dimensional prior-art device 96 of FIG. 16(a).

There are various possibilities with regard to alternative embodimentsof a solid state high power device and method according to an exemplaryembodiment.

In any device according to the various embodiments disclosed herein, thethermal stability of each individual emitter finger or subcell ispreferably maintained, to ensure thermal stability of a compositestructure that comprises all the emitter fingers or subcells together.To ensure the stability of the individual emitter fingers of a GaAsdevice, each finger may be less than 2 microns wide, preferablyapproximately one micron wide.

To ensure the stability of the individual emitter fingers of a GaAsdevice, the substrate thickness should also be thinned to a certainthickness depending on the overall heat dissipation of the device andfinger width, so that the substrate thickness may be less than 130microns, and preferably approximately 100 microns. A GaAs device havingan emitter finger width less than 2 microns and a substrate thicknessless than 130 microns is particularly preferred.

The foregoing description of exemplary embodiments of the invention havebeen presented for purposes of illustration and of description. It isnot intended to be exhaustive or to limit the invention to the preciseform disclosed, and modifications and variations are possible in lightof the above teachings or may be acquired from practice of theinvention. The embodiments were chosen and described in order to explainthe principles of the invention and as practical applications of theinvention to enable one skilled in the art to utilize the invention invarious embodiments and with various modifications as suited to theparticular use contemplated. It is intended that the scope of theinvention be defined by the claims appended hereto and theirequivalents.

1. A transistor comprising: a collector; a base, at least a portion ofthe base disposed on a portion of the collector; an emitter; and a firstplurality of emitter subcells extending from the emitter, the firstplurality of emitter subcells formed on a first portion of the base, anemitter subcell including an emitter finger; wherein the first pluralityof emitter subcells are arranged in a first arc-shaped row.
 2. Thetransistor of claim 1, further comprising: a second plurality of emittersubcells extending from the emitter, the second plurality of emittersubcells formed on a first portion of the base; wherein the secondplurality of emitter subcells are arranged in a second arc-shaped row.3. The transistor of claim 2, wherein the second arc-shaped row is amirror image of the first arc-shaped row relative to a plane extendingbetween the first arc-shaped row and the second arc-shaped row.
 4. Thetransistor of claim 1, wherein the first plurality of emitter subcellsincludes a first emitter subcell and a second emitter subcell, andfurther wherein the second emitter subcell includes a greater number ofemitter fingers than the first emitter subcell.
 5. The transistor ofclaim 4, further comprising a ballast resistor electrically connected inseries with at least one of the emitter fingers.
 6. The transistor ofclaim 2, further comprising: a third plurality of emitter subcellsextending from the emitter, the third plurality of emitter subcellsformed on a first portion of the base; wherein the third plurality ofemitter subcells are arranged in a third row, the third row arrangedbetween the first arc-shaped row and the second arc-shaped row.
 7. Thetransistor of claim 6, wherein the third plurality of emitter subcellsare arranged in the third row on either side of a central gap.
 8. Thetransistor of claim 1, wherein the first plurality of emitter subcellsincludes a first emitter subcell, a second emitter subcell, and a thirdemitter subcell, wherein the first emitter subcell is closer to a centerof the first arc-shaped row than either of the second emitter subcelland the third emitter subcell, and further wherein the third emittersubcell is farther from the center of the first arc-shaped row thaneither of the first emitter subcell and the second emitter subcell, afirst distance between the first emitter subcell and the second emittersubcell greater than a second distance between the second emittersubcell and the third emitter subcell.
 9. The transistor of claim 8,wherein the second emitter subcell includes a greater number of emitterfingers than the first emitter subcell.
 10. A transistor comprising: acollector; a base, at least a portion of the base disposed on a portionof the collector; an emitter; and a first plurality of emitter subcellsextending from the emitter, the first plurality of emitter subcellsformed on a first portion of the base, an emitter subcell including anemitter finger; wherein the first plurality of emitter subcells arearranged in a first row on either side of a central gap.
 11. Thetransistor of claim 10, wherein the first row is arc-shaped.
 12. Thetransistor of claim 10, further comprising: a second plurality ofemitter subcells extending from the emitter, the second plurality ofemitter subcells formed on a first portion of the base; wherein thesecond plurality of emitter subcells are arranged in a second row. 13.The transistor of claim 12, wherein the second plurality of emittersubcells are arranged in the second row on either side of a central gap.14. The transistor of claim 12, wherein the second row is arc-shaped.15. The transistor of claim 10, wherein the first plurality of emittersubcells includes a first emitter subcell and a second emitter subcell,and further wherein the second emitter subcell includes a greater numberof emitter fingers than the first emitter subcell.
 16. The transistor ofclaim 15, further comprising a ballast resistor electrically connectedin series with at least one of the emitter fingers.
 17. The transistorof claim 10, wherein the first plurality of emitter subcells includes afirst emitter subcell, a second emitter subcell, and a third emittersubcell, wherein the first emitter subcell is closer to a center of thefirst row than either of the second emitter subcell and the thirdemitter subcell, and further wherein the third emitter subcell isfarther from the center of the first row than either of the firstemitter subcell and the second emitter subcell, a first distance betweenthe first emitter subcell and the second emitter subcell greater than asecond distance between the second emitter subcell and the third emittersubcell.
 18. The transistor of claim 17, wherein the second emittersubcell includes a greater number of emitter fingers than the firstemitter subcell.
 19. The transistor of claim 18, further comprising aballast resistor electrically connected in series with at least one ofthe emitter fingers wherein a resistance of the ballast resistor isselected based on at least one of the first distance and the seconddistance.
 20. A transistor comprising: a collector; a base, at least aportion of the base disposed on a portion of the collector; an emitter;a first emitter subcell including an emitter finger extending from afirst portion of the emitter, the first emitter subcell formed on afirst portion of the base and further including a first lateral side anda second lateral side opposite the first lateral side; and a secondemitter subcell including an emitter finger extending from a secondportion of the emitter, the second emitter subcell formed on a secondportion of the base and further including a first lateral side and asecond lateral side opposite the first lateral side, wherein the firstlateral side of the second emitter subcell is proximate the secondlateral side of the first emitter subcell; a third emitter subcellincluding an emitter finger extending from a third portion of theemitter, the third emitter subcell formed on a third portion of the baseand further including a first lateral side and a second lateral sideopposite the first lateral side, wherein the first lateral side of thethird emitter subcell is proximate the second lateral side of the secondemitter subcell; wherein the first emitter subcell, the second emittersubcell, and the third emitter subcell are arranged in a row; whereinthe first lateral side of the first emitter subcell and the firstlateral side of the second emitter subcell are separated by a firstdistance; wherein the first lateral side of the second emitter subcelland the first lateral side of the third emitter subcell are separated bya second distance, and further wherein the first distance is greaterthan twice the second distance.